SMT Hybrid Packaging 2013: Exhibition and Conference Preview

20.02.2013:

The world of system integration in micro electronics will once again be gathered at the Nuremberg Exhibition Center from the 16th - 18th April, 2013 for the SMT Hybrid Packaging. Both the trade fair and the conference will focus on networks this year. The exhibited products and solutions will cover the whole spectrum of the SMT sector including design and development, PCB assembly, individual components and manufacturing technology. This year the SMT Hybrid Packaging will once again help suppliers and consumers to get together. The applications center of the Frauenhofer Institute for Reliability and Microintegration, for example, will be organising a live production line with the motto „Power on the Line - combined power of 16 technology partners". The technology consultation will continue to offer visitors and experts the opportunity to exchange information. Thus, the event will repeat popular, tried and tested formats while at the same time offering newest trends and developments to the visitors. Thanks to an optimized exhibition programme, visitors can plan their day more effectively. The joint booth of the 3D-MID research association is worth a visit, for example, as they have dedicated their production line to the theme „Mechatronics Integration in 3 Dimensions" this year. Further highlights at the SMT 2013 will naturally be the „Service Point EMS", the joint booth „Optics meets Electronics", the job board and of course the popular tutorials. Once again the SMT Hybrid Packaging proves itself to be the definitive, central meeting point for system integration in micro electronics.

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