On the occasion of its 25th anniversary the SMT Hybrid Packaging attracted numerous trade visitors and suppliers of SMT equipment and services to the Nuremberg exhibition halls. This is Europe's largest event in the area of system integration in micro electronics. There was also a special exhibition area dedicated to the anniversary of this event, which has witnessed a huge growth in the last 25 years. The topics presented by the exhibitors this year once again spanned from design and development to PCB assembly, as well as components and assembly technology. The technological trends and their developments in manufacturing were astounding in the production line-up, which was presented under the motto "Strong Performance -- from 0 to Production in 3 Days". Visitors were even able to see the latest testing equipment and so once again the SMT Hybrid Packaging presented the complete spectrum of Micro Electronic production and focused on the trendsetting topics in the sector. Electronic devices were also the focus at the joint booth of the 3D-MID research association and gave insight into Molded Interconnect Devices technology. Parallel to the exhibition, the congress participants were able to gain insight into the hot topic "Electronic Devices Technology in Electromobility" from top experts in the area. The anniversary edition of the SMT Hybrid Packaging also proved to be a great success for the organisers of this event. The sector can look forward to the next event, which will once again take place in Nuremberg next year, from 16th - 18th April 2013.